Asus Adds Support for 64GB Memory Modules to Intel 600/700 Motherboards
Asus on Thursday said it has released new versions of UEFI BIOS for DDR5-supporting Intel 600/700-series motherboards that enable support for 64 GB DIMMs. As a result, Asus's latest...
4 by on 3/14/2024
Western Digital Launches PC SN5000S SSD: Low-Cost Meets High Performance
Western Digital has introduced its new series of SSDs aimed at mainstream PCs, which combine high performance and low cost. The Western Digital PC SN5000S family of DRAM-less drives...
11 by on 3/14/2024
ASML Delivers First 2nm-Generation Low-NA EUV Tool, the Twinscan NXE:3800E
Our avid readers tend to look at microelectronics made using leading edge process technologies, which in case of Intel means usage of High-NA extreme ultraviolet (EUV) lithography a couple...
2 by on 3/13/2024
SiPearl's Rhea-2 CPU Added to Roadmap: Second-Gen European CPU for HPC
SiPearl, a processor designer supported by the European Processor Initiative, is about to start shipments of its very first Rhea processor for high-performance computing workloads. But the company is...
3 by on 3/8/2024
Marvell's 2nm IP Platform Enables Custom Silicon for Datacenters
Marvell this week introduced its new IP technology platform specifically tailored for custom chips for accelerated infrastructure made on TSMC's 2nm-class process technologies (possibly including N2 and N2P). The...
0 by on 3/8/2024
Intel CEO Pat Gelsinger to Deliver Computex Keynote, Showcasing Next-Gen Products
Taiwan External Trade Development Council (TAITRA), the organizer of Computex, has announced that Pat Gelsinger, chief executive of Intel, will deliver a keynote at Computex 2024 on June 4...
17 by on 3/8/2024
Intel to Hold Webinar to Discuss Long-Term Vision for Foundry, Separating Fab and Design Reporting
As Intel prepares to move its fabs into its new Intel Foundry business, it will change the way it reports results in the coming months. To discuss the company's...
1 by on 3/7/2024
Western Digital Issues Update on Company Split: CEOs for Post-Split Entities Announced
Now well in the midst of executing its plan to divide itself into separate hard drive and NAND businesses, Western Digital today offered a fresh update on the state...
27 by on 3/6/2024
JEDEC Publishes GDDR7 Memory Spec: Next-Gen Graphics Memory Adds Faster PAM3 Signaling & On-Die ECC
JEDEC on Tuesday published the official specifications for GDDR7 DRAM, the latest iteration of the long-standing memory standard for graphics cards and other GPU-powered devices. The newest generation of...
10 by on 3/6/2024
Apple Launches M3-Based MacBook Air 13 and 15: 3nm CPU for the Masses
Apple on Monday introduced its new generation MacBook Air laptops based on the company's most-recent M3 system-on-chip (SoC). The new MacBook Air notebooks come in the same sizes as...
48 by on 3/4/2024
SK Hynix Mulls 'Differentiated' HBM Memory Amid AI Frenzy
SK Hynix and AMD were at the forefront of the memory industry with the first generation of high bandwidth memory (HBM) back in 2013 – 2015, and SK Hynix...
10 by on 3/1/2024
Tenstorrent Licenses RISC-V CPU IP to Build 2nm AI Accelerator for Edge
Tenstorrent this week announced that it had signed a deal to license out its RISC-V CPU and AI processor IP to Japan's Leading-edge Semiconductor Technology Center (LSTC), which will...
22 by on 2/28/2024
Samsung Launches 12-Hi 36GB HBM3E Memory Stacks with 10 GT/s Speed
Samsung announced late on Monday the completion of the development of its 12-Hi 36 GB HBM3E memory stacks, just hours after Micron said it had kicked off mass production...
4 by on 2/27/2024
Micron Kicks Off Production of HBM3E Memory
Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company's HBM3E known good stack dies (KGSDs) will be used for Nvidia's H200...
8 by on 2/26/2024
AMD CEO Dr. Lisa Su to Deliver Opening Keynote at Computex 2024
Taiwan External Trade Development Council (TAITRA), the organizer of Computex, announced today that Dr. Lisa Su, AMD's chief executive officer, will give the trade show's Opening Keynote. Su's speech...
3 by on 2/22/2024
Arm and Samsung to Co-Develop 2nm GAA-Optimized Cortex Cores
Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA...
3 by on 2/22/2024
GlobalFoundries to Receive $1.5 Billion In Funding from U.S. CHIPS Act
The United States Department of Commerce and GlobalFoundires announced on Monday that the US will be awarding GlobalFoundries with $1.5 billion in funding under the CHIPS and Science Act...
5 by on 2/20/2024
GlobalFoundries: Clients Are Migrating to Sub-10nm Faster Than Expected
When GlobalFoundries abandoned development of its 7 nm-class process technology in 2018 and refocused on specialty process technologies, it ceased pathfinding, research, and development of all technologies related to...
26 by on 2/14/2024
ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities
ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only...
8 by on 2/14/2024
Report: NVIDIA Forms Custom Chip Unit for Cloud Computing and More
With its highly successful A100 and H100 processors for artificial intelligence (AI) and high-performance computing (HPC) applications, NVIDIA dominates AI datacenter deployments these days. But among large cloud service...
10 by on 2/13/2024
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