Packaging
In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated that Intel would be returning to product leadership in 2025, but hasn’t yet explained how this is coming about – that is until today, where Intel has disclosed its roadmap for its next five generations of process node technology leading to 2025. Intel believes it can follow an aggressive strategy to match and pass its foundry rivals, while at the same time developing new packaging offerings and starting a foundry business for external customers. On top of all this, Intel has renamed its process nodes.
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Intel Accelerated Webcast on July 26th: Update on Process Technology and Roadmaps
Earlier this year, new Intel CEO Pat Gelsinger outlined his new ‘IDM 2.0’ vision for Intel. This vision was a three pronged strategy based on improving its own process...
32 by Dr. Ian Cutress on 7/12/2021
3DFabric: The Home for TSMC’s 2.5D and 3D Stacking Roadmap
Interposers. EMIB. Foveros. Die-to-die stacking. ODI. AIB.TSVs. All these words and acronyms have one overriding feature – they are all involved in how two bits of silicon physically connect...
16 by Dr. Ian Cutress on 9/2/2020_carousel.jpg)
Intel Next-Gen 10-micron Stacking: Going 3D Beyond Foveros
One of the issues facing next-generation 3D stacking of chips is how to increase the density of the die-to-die interface. More connections means better data throughput, reducing latency and...
32 by Dr. Ian Cutress on 8/14/2020
Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology
Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs. Current...
21 by Andrei Frumusanu on 8/14/2020
AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D
One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...
12 by Dr. Ian Cutress on 3/5/2020
Intel's Interconnected Future: Combining Chiplets, EMIB, and Foveros
While Intel works on getting its main manufacturing process technology on track, it is spending just as much time and effort in researching and developing the rest of the...
117 by Ian Cutress on 4/17/2019
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